2026 GLOBAL FINALIST

Ternell

Chips & Fab

Innovative low-power memory using ternary states rather than binary Ternell provides ternary semiconductor technology-based IP for SRAM which is used as on-chip cache memory of AI SoC, and related specialty memory product including CAM, CIM and PUF. Our solution at 28-nm, offers 33% footprint reduction or density increase and 50% power reduction with T-SRAM IP. This 28-nm based IP is under productization for SRAM of DDI(Display Driver IC) chip for display panel. At 4-nm, offering +100% capacity density and 80% power reduction with T-SRAM IP. This 4-nm based IP is under productization for SRAM of AI SoC chip for HPC(High Performance Computing) and FSD(Full Self Driving) Chip."

🔗 https://www.ternellism.com/