2026 GLOBAL FINALIST
TeraSpatial, Inc.
Digital Infrastructure
As AI use moves from centralized into edge, TeraHaul™ custom silicon for 10× greater wireless capacity with TeraTwin™ - the AI layer providing network modeling, validation, optimization, and operational intelligence. Transforming wireless infrastructure with its dual-use TeraHaul™ product family, unleashing the physics-based advantages of millimeter wave – including ultra-high capacity, plentiful spectrum, massive bandwidth, anti-jamming capability, and compact form factor – to overcome the AI data movement bottleneck and deliver 10X the capacity of legacy wireless systems, with improved coverage and reduced latency. Powered by patented silicon, software, and embedded AI/ML, a built-in Wireless Digital Twin engine (TeraTwin™) that models the RF environment in real time, enabling AI-driven, site-specific awareness and dynamic adaptation.