2024 GLOBAL FINALIST
UniSCool
Chips & Fab
Intelligent direct-to-chip liquid cooling system Capable of reducing power consumption by 70%, based on a self-adaptive heat sink, which adjusts heat extraction more efficiently than current solutions to the local and instantaneous needs of the cooled device. Can be placed on-chip to replace the aluminum heat sinks in air cooling or incorporated inside the microchip itself and allows up to 70% lower electrical energy used in the cooling process, heat extraction of up to 300 W/cm2.
